Conference Sponsorship
Sponsored by
`191st Committee on Innovative Interface Bonding Technology Japan Society for the Promotion of Science (JSPS)
Co-Sponsored by
IEEE EPS Japan Chapter
The Japan Society of Applied Physics
Institute for Advanced Micro-System Integration (IMSI)
Exhibitors
AGC Inc.
Ayumi Industry Co., Ltd.
Bondtech Co., Ltd.
Canon Anelva Corporation
Hitachi High Technologies Corporation
Mitsubishi Heavy Industries Machine Tool Co., Ltd.
Murata Manufacturing Co., Ltd.
Musahino Engineering Co., Ltd.
The background of the title logo is designed by permission of Seikan Azuma.