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2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019) will be held from 21-25, May 2019 at Kanazawa-city, Japan.
The LTB-3D is a premier conference series sponsored by the 191st Committee on Innovative Interface Bonding Technology, Japan Society for the Promotion of Science (JSPS), and cosponsored by the IEEE EPS Japan Chapter, preceding 1st (2007), 2nd (2010), 3rd (2012), 4th (2014), and 5th (2017) in Tokyo, and in coming 2019, moving to an attractive old city, Kanazawa as WaferBond 2019 EAST in conjunction with WaferBond conferences which are held in Europe every two years: 2009 (Grenoble), 2011 (Chemnitz), 2013 (Stockholm), 2015 (Braunschweig), and 2017 (Leuven) .
This workshop is focusing on the promotion of advanced research areas related to low-temperature bonding technologies, including surface activated bonding (SAB), which realize novel device structure by heterogeneous material and device integration and lead to entirely new manufacturing approaches to 3D and module integration of semiconductor devices, photonics systems, and power electronic systems. These bonding technologies have been already used for the volume production and have potential applications in wide range of manufacturing industries. It has been attracting over 200 attendees with participants from more than 20 countries and regions worldwide. This workshop will be held as a single-track seminar to provide comprehensive information on the latest technologies and applications, as well as business opportunities.
Professor Dr. Tadatomo Suga
The Univeristy of Tokyo
191st Committee on Innovative Interface Bonding Technology, JSPS
IEEE EPS Japan Chapter
Conference Scope:
3D & Hetero Integration
Wafer Bonding
Surface Activated Bonding (SAB) and its Extensions
Hydrophilic & Plasma-assist Bonding
III-V & Photonics Integration
Low-Temperature Bonding and Applications
Bonding and Debonding for High-Temperature Applications
Bonding for Power Module Integration
Bonding for Polymer and Glass Device Integration
Bonding Diamond and Carbon Materials
Bonding for Biosensing Device Integration
MEMS and Optoelectronic system Integration
Bonding for Nano-Micro System
Bonding Theromoelectonic Materials
Bonding High-Temperature Superconductors
Bonding Interface Reliability
Equipments and Quality Assessment
Jpn. J.Appl. Phys.(JJAP) Special Issue:
Authors of papers that are accepted and presented in LTB-3D 2019 are kindly
advised to consider submission of their original papers on the significant
part of their work presented at the workshop to a special issue of
Japanese Journal of Applied Physics (JJAP) entitled
"Advances in low-temperature bonding for 3D integration."
Publication charge of papers of this special issue is 20,000 Japanese Yen per paper.
The web site for submission is available. Provisional authors are advised to sign in the following site:
https://mc04.manuscriptcentral.com/jjaps-jsap
By selecting Author tab, "Start New Submission" page appears. Steps for submitting manuscripts are found by pressing "Begin Submission".
Please kindly select "Low Temperature Bonding for 3D Integration" in "Select Special Issue:" window in "Step1: Article Information" part.
Instructions for preparing manuscripts are available on "About the Journal"
and "Author Guidelines" pages of JJAP website.
Please get reminded that the "no-show no-publication" and "one-presentation one-submission" policies are applied.
In submission process, the authors are advised to cite the codes of their presentations (session number) such as 22O-01.
The codes of presentations are shown on the conference program.
The paper categories in the Special Issue are Regular Paper, Brief Note, and Progress Review.
The authors of Regular Papers and Brief Notes are requested to cite their presentations (one-page abstracts) and show the
advantage in comparison with the presentations.
The deadline of submission has been extended to July 31, 2019.
The review process for the submitted manuscripts shall be managed by the editorial committee of the Special Issue.
Note that the submitted manuscripts to the Special Issue shall be reviewed and edited based on the same standards
applied for submissions to regular issues of JJAP.
We are looking forward to receiving your submission.
Important date:
- Manuscript (one-page summary) Submission Deadline:
January 11th, 2019
- Acceptance/Rejection Notification:
February 18th, 2019
- Improved final version of one-page summary and Presentation Materials Deadline:
March 18th, 2019
- Conferenece:
May 21th-25 th, 2019
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