Steering Committee
T. SUGA, The University of Tokyo (Conference Chair)
T. SHIMATSU. Tohoku University(Conference Vice Chair)
H. TAKAGI, AIST (Technical Program Chair )
N. TOYODA, University of Hyogo (Technical Program Vice Chair )
E. HIGURASHI, AIST / The University of Tokyo (Publication Chair)
N. SHIGEKAWA, Osaka city University (Publication Vice Chair)
H. ISHIDA, SUSS Micro Teck (Technical Program Vice Chair )
M. FUJINO, AIST (Local Arrangement Chair)
N. KAWAMATA, The University of Tokyo (Conference Treasurer, Conference Secretary)
Advisory Committee
Y. TAIRA, Keio University(IEEE EPS Society Japan Chapter Chair)
S. AOKI, Fujitsu Laboratories (IEEE EPS Society Japan Chapter Vice Chair )
T. HATAKEYAMA, Toyama Prefectural University (IEEE EPS Society Japan Chapter Secretary)
N. TANAKA, Hitachi Chemical Co., Ltd. (IEEE EPS Society Japan Chapter Treasurer)
K. YOKOUCHI, Fujitsu Interconnect Tecknologies Ltd
M. AOYAGI, AIST (IEEE EPS Society Japan Chapter Advisor)
Y. ANDO, Fujikura (IEEE EPS Society Japan Chapter Advisor )
K. OTSUKA, Meisei University (IEEE EPS Society Japan Chapter Advisor )
T. SUDO, Shibaura Institute (IEEE EPS Society Japan Chapter Advisor )
Y. TAKAHASHI, Fuji Electric Co.,ltd (IMSI Representative Director )
T. ITOH, University of Tokyo (IMSI Director)
International Advisory Committee
Dorota Tempel, Research Triangle Institute (USA), Distinguished Fellow
Frank Fournel CEA, Leti (France), Head of bonding Engineering
Jamal Deen, McMaster University (Canada), Professor
Jenn-Ming Song, National Chung Hsing University(Taiwan), Professor
Helmut Baumgart, Old Dominion University (USA), Professor
Karl Hobalt, Naval Research Lab (USA), Supervisory Electrical Engineer
Tianchun Ye, Institute of Microelectronics of Chinese Academy of Sciences (China), Director
Rolf Aschenbrenner, Fraunhofer IZM (Germany), Deputy Director
Roy Knechtel, X-FAB Semiconductor Foundries AG (Germany) Project manager
Dapeng Chen, Institute of Microelectronics of Chinese Academy of Sciences (China), Vice Director
Local Organizing Committee
191st Committee on Innovative Interface Bonding Technology,
University-Industry Cooperative Research Committees, Japan Society for the Promotion of Science (JSPS)
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