May 16, Tuesday

 

8:30 REGISTRATION

9:00 OPENING REMARKS

9:20 SURFACE ACTIVATED BONDING (SAB) I

10:40 SURFACE ACTIVATED BONDING (SAB) II

12:20 LUNCH

13:50 MEMS and SENSOR INTEGRATION

16:50 LOW-TEPMERATURE BONDING and APPLICATIONS

 

May 17, Wednesday

 

8:30 BONDING PROCESS INTEGRATION

10:50 SHORT PRESENTAION for Poster

11:50 LUNCH / POSTER

13:20 STUDENT SESSION SHORT PRESENTAION for Poster

14:40 POSTER

15:30 HETERO-INTEGRATION

17:30 RECEPTION (Bus Transfer to Tokyo Bay Cruise)

 

May 18, Thursday

 

8:30 STUDENT SESSION

11:45 LUNCH

13:40 PACKAGING INTEGRATION

16:30 TUTORIAL

17:30 AWARDS

17:50 CLOSING REMARKS

18:30 STUDENT RECEPTION (Restaurant Abreuvoir)