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RTI International, Fellow, United States Wafer-to-Wafer Bonding for Vacuum and Hermetic Packaging of Smart Sensors Dr. Dorota Temple is a Distinguished Fellow at RTI International, headquartered in the Research Triangle Park in the United States, where she has led teams of scientists and engineers in the development of 3D microsystem integration and flexible electronics technologies for applications in infrared imagers, radar systems, high performance computing modules, and medical devices. She has authored or coauthored over 150 technical publications, and holds 10 US Patents. Educated as a solid-state physicist, she received her Ph.D. and M.S. degrees from the AGH University of Science and Technology in Krakow, Poland.
Macmaster University, Canada Micro- & Nano-Systems Integration - the Next Frontier
CEA LETI, Expert International, France Low Temperature Direct Bonding Comparison
Fraunhofer IZM Tackling Low Temperature Bonding in Fine Pitch Applications
IBM Research Division, Thomas J. Watson Research Center Next Generation Computing Systems with Heterogeneous Packaging Integration Dr. Knickerbocker is an IBM Distinguished Engineer and member of IBM Academy. He is the executive manager of Micro-Systems Technology and Solutions Team at IBM Research. He received his PhD degree in 1982 from the University of Illinois studying Materials Science & Engineering. He has over 20 years experience at IBM Microelectronics and 14 year at IBM Research focusing on Packaging and Electronics Integration Technologies. From concept innovations, through research and development demonstrations, his advancements in packaging and collaboration with IBM and Client teams have led to Billions of products shipped. He is currently focused on packaging and integration for Healthcare, IoT, Micro-systems, Super Computers, Quantum Computers and advancements in Miniaturization Technologies. He has authored or co-authored over 300 patents or patent applications and more than 80 technical papers, presentations and publications. He has over 10 years of participation with the Advanced Packaging Technology Committee at Electronic Components and Technology Conference (IEEE).
Technische Universität Berlin Advanced Packaging for Wide Band Gap Pwer Semiconductors Gudrun Feix received her B.Sc. and M.Sc. in electrical engineering from the department of Electrical Engineering and Computer Science at Technical University Berlin in 2007 and 2008, respectively. Since then, she has been working at TU Berlin/Fraunhofer IZM in power electronics. Her main research focus is on power electronics packaging, beginning from wire bonded modules to double sided cooling of power electronics right up to advanced packaging technologies like embedded power electronics for fast switching semiconductors.
Fraunhofer ISE Fabrication of Highly Efficient Four-Junction Solar Cells by Surface-Activated Wafer-Bonding After finishing high-school in 2008, Felix Predan studied Micro System Engineering at the Albrecht-Ludwigs University of Freiburg, obtaining a Master of Science degree in 2014. Beside his studies, Felix Predan worked since 2011 at the Fraunhofer Institute for Solar Energy Systems ISE in different fields of solar cell research like laser doping for industrial solar cells based on silicon as well as on the technology for micro-structuring of multi-junction solar cells. In the year 2014, Felix Predan did his master thesis in the development of a surface-activated wafer bonding (SAB) process for antimonides. Since 2015, Felix Predan makes a Ph.D., supported by a scholarship from the German Federal Environmental Foundation, DBU. The aim of his research is the development of a novel four-junction solar cell based on GaSb utilizing the SAB approach. This cell has prospects to reach highest conversion efficiencies > 50 % and could be applied in the concentrating photovoltaics or in space.
Old Dominion University Development of Thermoelectric Materials with Improved Figure of Merit for Better Conversion Efficiency Dr. Baumgart is professor of Electrical and Computer Engineering at Old Dominion University in Norfolk, Virginia, where he holds the VMEC Endowed Chair. He received his Ph.D. degree in physics from the University of Stuttgart, Germany (1981)), while performing his Ph.D. research at the Max-Planck Institute of Solid State Research in Stuttgart. Before joining Old Dominion University he has pursued a long career in the high tech industry, where he held numerous R&D positions in the microelectronics industry. He has worked extensively in SOI research at AT&T Bell Laboratories; at Royal Philips Electronics' Briarcliff Research Laboratories and at their Natuurkundig Laboratorium in Eindhoven; at IBM Microelectronics at the Advanced Semiconductor Technology Center (ASTC); at Infineon Technologies in Richmond, and at Motorola's Advanced Products Research & Development Laboratories (APRDL) in Austin. In his research areas he has authored and co-authored over 60 papers, he has published and edited 8 Electrochemical Society Conference Proceedings Volumes; he has delivered 27 conference presentations including numerous invited talks, and holds three U.S. Patents and 15 Patent Disclosures and is the recipient of numerous industry awards. |
