活動記録

218th Meeting of ECS (The Electrochemical Society)
11th International Symposium of Semiconductor Wafer Bonding: Science, Technology, and Applications
Las Vegas, NV, October 10-15, 2010

2nd International IEEE Workshop on Low Temperature Bonding for 3D Integration
The University of Tokyo, Hongo, Japan
Planned in coming January,19-20, 2010

1st International IEEE Workshop on Low Temperature Bonding for 3D Integration
The University of Tokyo, Hongo, Japan
November 8-9, 2007

PRiME 2008, 214th Meeting of ECS (The Electrochemical Society)
10th International Symposium of Semiconductor Wafer Bonding: Science, Technology, and Applications
Honolulu, Hawaii, October 12-17, 2008